Coupon Manufacturing Requirements

1.  All coupons shall be produced on production panels.

2.  Twelve (12) coupons shall be produced with two coupons originating from opposing corners of the panels.

3.  The coupons shall be produced along with a product board of appropriate stack-up and copper weights.

4.  Do not modify the coupon design except for etch compensation.

5.  The values specified in the Gerber files for conductor and land sizes are finished dimensions.

6.  Etch compensation should be applied to the conductors and lands in order to achieve the specified dimensions.

7.  Do not add teardrops to the lands.

8.  Do not compensate the drill sizes.

9.  Do not add additional copper fill patterns to the coupon design.

10.  Do not separate the AB/R and D coupons.

11.  Bag and label the coupon based on their panel and location.


IPC 6012 QML Program Testing Requirements

1.  Microsections are in accordance with IPC-TM-650 method 2.1.1 at a resolution equivalent to 200X magnification for the entire section.

2.  Reflow simulation is in accordance with IPC-TM-650 method 2.6.27.

3.  Annular ring assessment is in accordance with IPC Class 2 or 3 using an electrical continuity test of the R features of the AB/R coupons prior to reflow simulation.

4.  Assessment of features, attributes and dimensions is in accordance with IPC-A-600 and conforms with all IPC-6012 3.6.2 paragraphs using the AB/R coupons after reflow simulation.

5.  Thermal stress assessment from reflow simulation shall not exceed 5% change in resistance using the D coupons.

6.  Thermal stress assessment from thermal shock (after reflow simulation) shall not exceed 10% change in resistance per IPC-TM-650 method 2.6.7.2 using the D coupons.


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